Power chips are connected to outside circuits with product packaging, and their efficiency depends on the assistance of the product packaging. In high-power circumstances, power chips are usually packaged as power modules. Chip interconnection describes the electric link on the upper surface of the chip, which is generally aluminum bonding wire in typical modules. ^
Traditional power module plan cross-section
At present, commercial silicon carbide power components still mainly use the product packaging modern technology of this wire-bonded typical silicon IGBT module. They encounter troubles such as big high-frequency parasitic specifications, inadequate warm dissipation capability, low-temperature resistance, and inadequate insulation toughness, which limit the use of silicon carbide semiconductors. The display of excellent efficiency. In order to solve these problems and fully exploit the huge potential advantages of silicon carbide chips, lots of new product packaging technologies and solutions for silicon carbide power modules have arised over the last few years.
Silicon carbide power component bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually created from gold wire bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually created from gold cables to copper cables, and the driving force is expense decrease; high-power tools have actually created from light weight aluminum wires (strips) to Cu Clips, and the driving pressure is to boost item performance. The better the power, the greater the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that uses a solid copper bridge soldered to solder to attach chips and pins. Compared to conventional bonding packaging approaches, Cu Clip technology has the following advantages:
1. The connection between the chip and the pins is made from copper sheets, which, to a specific degree, changes the basic cord bonding approach between the chip and the pins. Consequently, a special package resistance worth, greater existing circulation, and much better thermal conductivity can be gotten.
2. The lead pin welding area does not require to be silver-plated, which can totally save the expense of silver plating and inadequate silver plating.
3. The item appearance is entirely consistent with normal products and is primarily made use of in web servers, mobile computers, batteries/drives, graphics cards, motors, power products, and various other areas.
Cu Clip has 2 bonding approaches.
All copper sheet bonding approach
Both the Gate pad and the Resource pad are clip-based. This bonding method is more costly and intricate, yet it can achieve far better Rdson and far better thermal results.
( copper strip)
Copper sheet plus wire bonding method
The resource pad makes use of a Clip approach, and eviction utilizes a Wire technique. This bonding approach is somewhat cheaper than the all-copper bonding approach, saving wafer location (applicable to very tiny entrance locations). The process is less complex than the all-copper bonding approach and can obtain better Rdson and much better thermal effect.
Provider of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding alloy of copper and tin, please feel free to contact us and send an inquiry.
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